Invention Grant
- Patent Title: Carrier system for processing semiconductor substrates, and methods thereof
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Application No.: US14451043Application Date: 2014-08-04
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Publication No.: US09640419B2Publication Date: 2017-05-02
- Inventor: Manfred Schneegans , Martin Mischitz , Michael Roesner , Michael Pinczolits
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/02 ; H01L23/00 ; H01L23/495
Abstract:
In accordance with an alternative embodiment of the present invention, a method for forming a semiconductor device includes applying a paste over a semiconductor substrate, and forming a ceramic carrier by solidifying the paste. The semiconductor substrate is thinned using the ceramic carrier as a carrier.
Public/Granted literature
- US20160035560A1 Carrier System For Processing Semiconductor Substrates, and Methods Thereof Public/Granted day:2016-02-04
Information query
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