Invention Grant
- Patent Title: Molded parts
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Application No.: US14245834Application Date: 2014-04-04
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Publication No.: US09643364B2Publication Date: 2017-05-09
- Inventor: Bryan P. Kiple , Michael B. Wittenberg , Dhaval N. Shah , Daniel W. Jarvis
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Downey Brand LLP
- Main IPC: B32B3/10
- IPC: B32B3/10 ; B29C70/62 ; B29C45/16 ; H05K7/18 ; B29K105/16 ; B29C45/00

Abstract:
A method and apparatus for injection molding plastic parts is described. In one embodiment, at least two materials are simultaneously injected into a mold. The resulting molded part can include at least two different regions. Each region can have distinct physical properties. Positions of the regions within the molded part can be at least partially controlled by controlling flow fronts of the at least two materials within the mold.
Public/Granted literature
- US20140220320A1 MOLDED PARTS Public/Granted day:2014-08-07
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