公开(公告)号：US11240928B2

公开(公告)日：2022-02-01

申请号：US17032956

申请日：2020-09-25

Applicant: Apple Inc.

Inventor： Bryan P. Kiple ,  Charles B. Woodhull ,  David A. Pakula ,  Tang Y. Tan

IPC: H05K5/04 ,  B23P11/00 ,  B23P17/00 ,  G03F1/38 ,  H01Q1/24 ,  H04M1/02 ,  C25D11/34 ,  H05K5/02 ,  H05K13/00 ,  C25D11/02 ,  C25D7/00 ,  C25D11/12 ,  H05K5/03 ,  H01Q1/42 ,  B23C5/10 ,  B23C5/00 ,  B23P17/02 ,  H04M1/11 ,  C25D11/24

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US20180098444A1

公开(公告)日：2018-04-05

申请号：US15832606

申请日：2017-12-05

Applicant: Apple Inc.

Inventor： Bryan P. Kiple ,  Charles B. Woodhull ,  David A. Pakula ,  Tang Y. Tan

IPC: H05K5/04 ,  B23P17/00 ,  B23P11/00 ,  G03F1/38 ,  H04M1/02 ,  H01Q1/24 ,  H05K5/02 ,  B23C5/10 ,  H04M1/11 ,  B23C5/00 ,  B23P17/02 ,  C25D11/34

CPC classification number: H05K5/04 ,  B23C5/00 ,  B23C5/1081 ,  B23C2220/04 ,  B23C2220/16 ,  B23C2220/20 ,  B23C2220/28 ,  B23C2220/48 ,  B23C2226/31 ,  B23C2226/315 ,  B23P11/00 ,  B23P17/00 ,  B23P17/02 ,  C25D7/00 ,  C25D11/02 ,  C25D11/022 ,  C25D11/12 ,  C25D11/246 ,  C25D11/34 ,  G03F1/38 ,  H01Q1/243 ,  H01Q1/42 ,  H04M1/0249 ,  H04M1/0254 ,  H04M1/11 ,  H05K5/02 ,  H05K5/0217 ,  H05K5/0243 ,  H05K5/0247 ,  H05K5/03 ,  H05K13/00 ,  Y10T29/47 ,  Y10T29/49002 ,  Y10T29/49826 ,  Y10T156/10 ,  Y10T156/1064 ,  Y10T407/1906 ,  Y10T409/300896 ,  Y10T409/303752 ,  Y10T409/30952

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US20140220320A1

公开(公告)日：2014-08-07

申请号：US14245834

申请日：2014-04-04

Applicant: Apple Inc.

Inventor： Bryan P. Kiple ,  Michael B. Wittenberg ,  Dhaval N. Shah ,  Daniel W. Jarvis

IPC: B29C70/62 ,  H05K7/18

CPC classification number: B29C70/62 ,  B29C45/0013 ,  B29C45/164 ,  B29K2105/16 ,  H05K7/18 ,  Y10T428/24802 ,  Y10T428/24909 ,  Y10T428/24926

Abstract: A method and apparatus for injection molding plastic parts is described. In one embodiment, at least two materials are simultaneously injected into a mold. The resulting molded part can include at least two different regions. Each region can have distinct physical properties. Positions of the regions within the molded part can be at least partially controlled by controlling flow fronts of the at least two materials within the mold.

Abstract translation: 描述了用于注塑塑料部件的方法和装置。 在一个实施例中，将至少两种材料同时注入模具中。 所得模制部件可以包括至少两个不同的区域。 每个区域都可以具有不同的物理性质。 可以通过控制模具内的至少两种材料的流动前沿来至少部分地控制模制部件内的区域的位置。

公开(公告)号：US12137529B2

公开(公告)日：2024-11-05

申请号：US18183825

申请日：2023-03-14

Applicant: Apple Inc.

Inventor： Bryan P. Kiple ,  Charles B. Woodhull ,  David A. Pakula ,  Tang Y. Tan

IPC: H05K5/04 ,  B23C5/00 ,  B23C5/10 ,  B23P11/00 ,  B23P17/00 ,  B23P17/02 ,  C25D11/02 ,  C25D11/12 ,  C25D11/34 ,  G03F1/38 ,  H01Q1/24 ,  H01Q1/42 ,  H04M1/02 ,  H04M1/11 ,  H05K5/02 ,  H05K5/03 ,  H05K13/00 ,  C25D11/24

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US10667418B2

公开(公告)日：2020-05-26

申请号：US15958915

申请日：2018-04-20

Applicant: Apple Inc.

Inventor： Bryan P. Kiple ,  Charles B. Woodhull ,  David A. Pakula ,  Tang Y. Tan ,  Michael P. Coleman ,  Thomas Johannessen ,  Richard W. Heley

IPC: G06F1/16 ,  H05K5/04 ,  B23P11/00 ,  B23P17/00 ,  G03F1/38 ,  H01Q1/24 ,  H04M1/02 ,  C25D11/34 ,  H05K5/02 ,  H05K13/00 ,  C25D11/02 ,  C25D7/00 ,  C25D11/12 ,  H05K5/03 ,  H01Q1/42 ,  B23C5/10 ,  B23C5/00 ,  B23P17/02 ,  H04M1/11 ,  C25D11/24

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US10285295B2

公开(公告)日：2019-05-07

申请号：US16042992

申请日：2018-07-23

Applicant: Apple Inc.

Inventor： Bryan P. Kiple ,  Charles B. Woodhull ,  David A. Pakula ,  Tang Y. Tan

IPC: H05K5/04 ,  B23P17/00 ,  B23P11/00 ,  G03F1/38 ,  H04M1/02 ,  H01Q1/24 ,  H05K5/02 ,  B23C5/10 ,  H04M1/11 ,  B23C5/00 ,  B23P17/02 ,  C25D11/34 ,  C25D11/12 ,  C25D11/02 ,  H01Q1/42 ,  H05K5/03 ,  C25D7/00 ,  H05K13/00 ,  C25D11/24

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US11653466B2

公开(公告)日：2023-05-16

申请号：US17645709

申请日：2021-12-22

Applicant: Apple Inc.

Inventor： Bryan P. Kiple ,  Charles B. Woodhull ,  David A. Pakula ,  Tang Y. Tan

IPC: H05K5/04 ,  B23P11/00 ,  B23P17/00 ,  G03F1/38 ,  H01Q1/24 ,  H04M1/02 ,  C25D11/34 ,  H05K5/02 ,  H05K13/00 ,  C25D11/02 ,  C25D11/12 ,  H05K5/03 ,  H01Q1/42 ,  B23C5/10 ,  B23C5/00 ,  B23P17/02 ,  H04M1/11 ,  C25D11/24

CPC classification number: H05K5/04 ,  B23C5/00 ,  B23C5/1081 ,  B23P11/00 ,  B23P17/00 ,  B23P17/02 ,  C25D11/02 ,  C25D11/022 ,  C25D11/12 ,  C25D11/34 ,  G03F1/38 ,  H01Q1/243 ,  H01Q1/42 ,  H04M1/0254 ,  H04M1/11 ,  H05K5/02 ,  H05K5/0217 ,  H05K5/0243 ,  H05K5/0247 ,  H05K5/03 ,  H05K13/00 ,  B23C2220/04 ,  B23C2220/16 ,  B23C2220/20 ,  B23C2220/28 ,  B23C2220/48 ,  B23C2226/31 ,  B23C2226/315 ,  C25D11/246 ,  H04M1/0249 ,  Y10T29/47 ,  Y10T29/49002 ,  Y10T29/49826 ,  Y10T156/10 ,  Y10T156/1064 ,  Y10T407/1906 ,  Y10T409/300896 ,  Y10T409/30952 ,  Y10T409/303752

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US10034402B2

公开(公告)日：2018-07-24

申请号：US15832606

申请日：2017-12-05

Applicant: Apple Inc.

Inventor： Bryan P. Kiple ,  Charles B. Woodhull ,  David A. Pakula ,  Tang Y. Tan

IPC: H05K5/04 ,  B23P17/00 ,  H05K5/02 ,  G03F1/38 ,  H04M1/02 ,  H01Q1/24 ,  B23C5/10 ,  H04M1/11 ,  B23C5/00 ,  B23P17/02 ,  C25D11/34 ,  C25D11/12 ,  C25D11/02 ,  H01Q1/42 ,  H05K5/03 ,  C25D7/00 ,  H05K13/00 ,  B23P11/00 ,  C25D11/24

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US12238882B2

公开(公告)日：2025-02-25

申请号：US18438822

申请日：2024-02-12

Applicant: Apple Inc.

Inventor： Bryan P. Kiple ,  Charles B. Woodhull ,  David A. Pakula ,  Tang Y. Tan

IPC: H05K5/04 ,  B23C5/00 ,  B23C5/10 ,  B23P11/00 ,  B23P17/00 ,  B23P17/02 ,  C25D11/02 ,  C25D11/12 ,  C25D11/34 ,  G03F1/38 ,  H01Q1/24 ,  H01Q1/42 ,  H04M1/02 ,  H04M1/11 ,  H05K5/02 ,  H05K5/03 ,  H05K13/00 ,  C25D11/24

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US09854694B2

公开(公告)日：2017-12-26

申请号：US14821620

申请日：2015-08-07

Applicant: Apple Inc.

Inventor： Bryan P. Kiple ,  Charles B. Woodhull ,  David A. Pakula ,  Tang Y. Tan

IPC: H05K5/04 ,  B23P11/00 ,  B23P17/00 ,  G03F1/38 ,  H01Q1/24 ,  H04M1/02 ,  H05K5/02 ,  H05K13/00 ,  C25D11/02 ,  C25D7/00 ,  C25D11/12 ,  H05K5/03 ,  H01Q1/42 ,  C25D11/34 ,  B23C5/10 ,  B23C5/00 ,  B23P17/02 ,  H04M1/11 ,  C25D11/24

CPC classification number: H05K5/04 ,  B23C5/00 ,  B23C5/1081 ,  B23C2220/04 ,  B23C2220/16 ,  B23C2220/20 ,  B23C2220/28 ,  B23C2220/48 ,  B23C2226/31 ,  B23C2226/315 ,  B23P11/00 ,  B23P17/00 ,  B23P17/02 ,  C25D7/00 ,  C25D11/02 ,  C25D11/022 ,  C25D11/12 ,  C25D11/246 ,  C25D11/34 ,  G03F1/38 ,  H01Q1/243 ,  H01Q1/42 ,  H04M1/0249 ,  H04M1/0254 ,  H04M1/11 ,  H05K5/02 ,  H05K5/0217 ,  H05K5/0243 ,  H05K5/0247 ,  H05K5/03 ,  H05K13/00 ,  Y10T29/47 ,  Y10T29/49002 ,  Y10T29/49826 ,  Y10T156/10 ,  Y10T156/1064 ,  Y10T407/1906 ,  Y10T409/300896 ,  Y10T409/303752 ,  Y10T409/30952

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.