- 专利标题： Wafer-level package and method for production thereof
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申请号： US14007074申请日： 2012-03-28
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公开(公告)号： US09647196B2公开(公告)日： 2017-05-09
- 发明人: Christian Bauer , Hans Krueger , Juergen Portmann , Alois Stelzl , Wolfgang Pahl , Robert Koch
- 申请人： Christian Bauer , Hans Krueger , Juergen Portmann , Alois Stelzl , Wolfgang Pahl , Robert Koch
- 申请人地址： US CA San Diego
- 专利权人： SNAPTRACK, INC.
- 当前专利权人： SNAPTRACK, INC.
- 当前专利权人地址： US CA San Diego
- 优先权： DE102011016554 20110408
- 国际申请： PCT/EP2012/055559 WO 20120328
- 国际公布： WO2012/136544 WO 20121011
- 主分类号： H01L41/053
- IPC分类号： H01L41/053 ; B81C1/00 ; H03H9/10 ; H01L41/25 ; H01L23/00
摘要：
A hermetic wafer-level package composed of two piezoelectric wafers, preferably identical in terms of material, and a production method therefor are presented. The electrical and mechanical connection between the two wafers is accomplished with frame structures and pillars, the partial structures of which, distributed between two wafers, are wafer-bonded with the aid of connecting layers.
公开/授权文献
- US20140111062A1 Wafer-Level Package and Method for Production Thereof 公开/授权日：2014-04-24
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