Invention Grant
- Patent Title: Methods for securing features to housings
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Application No.: US14135391Application Date: 2013-12-19
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Publication No.: US09649733B2Publication Date: 2017-05-16
- Inventor: Douglas Joseph Weber
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Downey Brand LLP
- Main IPC: B23P19/04
- IPC: B23P19/04 ; B32B37/02 ; B32B38/04 ; H05K5/02 ; B29C45/14 ; B29L31/34 ; B29C45/16 ; B29K705/00

Abstract:
A housing for an electronic device as well as methods for forming the housing are disclosed. The housing can be formed from a substrate having perforations to assist in adhering components internal to the housing. The substrate is typically a multi-layer substrate having at least two layers. In one embodiment, an inner layer of the multi-layer substrate can be provided with perforations. The perforations can them be used to adhere internal features to the multi-layer substrate. The internal features can be used for attaching parts or components to the multi-layer substrate, thereby securing the parts or components to the multi-layer substrate and thus the housing.
Public/Granted literature
- US20140109382A1 METHODS FOR SECURING FEATURES TO HOUSINGS Public/Granted day:2014-04-24
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