Invention Grant
- Patent Title: Temperature controlled chamber liner
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Application No.: US13632585Application Date: 2012-10-01
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Publication No.: US09653267B2Publication Date: 2017-05-16
- Inventor: James D. Carducci , Kallol Bera , Nipun Misra , Larry D. Elizaga
- Applicant: James D. Carducci , Kallol Bera , Nipun Misra , Larry D. Elizaga
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: C23C16/00
- IPC: C23C16/00 ; H01J37/32
Abstract:
A liner for a semiconductor processing chamber and a semiconductor processing chamber are provided. In one embodiment, a liner for a semiconductor processing chamber includes a body having an outwardly extending flange. A plurality of protrusions extend from a bottom surface of the flange. The protrusions have a bottom surface defining a contact area that is asymmetrically distributed around the bottom surface of the flange.
Public/Granted literature
- US20130118686A1 TEMPERATURE CONTROLLED CHAMBER LINER Public/Granted day:2013-05-16
Information query
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