Invention Grant
- Patent Title: Metallic device having mobile element in a cavity of the BEOL of an integrated circuit
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Application No.: US14920621Application Date: 2015-10-22
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Publication No.: US09653392B2Publication Date: 2017-05-16
- Inventor: Christian Rivero , Pascal Fornara , Sebastian Orellana
- Applicant: STMicroelectronics (Rousset) SAS
- Applicant Address: FR Rousset
- Assignee: STMICROELECTRONICS (ROUSSET) SAS
- Current Assignee: STMICROELECTRONICS (ROUSSET) SAS
- Current Assignee Address: FR Rousset
- Agency: Slater Matsil, LLP
- Priority: FR1552744 20150331
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L23/532 ; H01H59/00 ; H01H1/00 ; H01H61/00
Abstract:
In order, for example, to improve the ohmic contact between two metal pieces located at a metallization level, these two metal pieces are equipped with two offset vias located at the metallization level and at least partially at the via level immediately above. Each offset via comprises, for example, a nonoxidizable or substantially nonoxidizable compound, such as a barrier layer of Ti/TiN.
Public/Granted literature
- US20160293540A1 Metallic Device Having Mobile Element in a Cavity of the BEOL of an Integrated Circuit Public/Granted day:2016-10-06
Information query
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