Invention Grant
- Patent Title: Semiconductor structure having a dummy contact and manufacturing method thereof
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Application No.: US14739702Application Date: 2015-06-15
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Publication No.: US09653558B2Publication Date: 2017-05-16
- Inventor: Shih-Yin Hsiao , Kai-Kuen Chang , Kun-Huang Yu
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsinchu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, PC
- Agent Justin King
- Priority: CN201510247125 20150515
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/40 ; H01L21/762 ; H01L29/66 ; H01L29/78 ; H01L29/06 ; H01L29/423 ; H01L29/10

Abstract:
A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes a substrate, a source region, a drain region, a gate, and a dummy contact. The source region and the drain region are formed in the substrate. The gate is formed on the substrate and between the source region and the drain region. The dummy contact includes a plurality of dummy plugs formed on the substrate, wherein the dummy plugs have depths decreasing towards the drain region.
Public/Granted literature
- US20160336410A1 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-11-17
Information query
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