Invention Grant
- Patent Title: Polyimide and film using same
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Application No.: US15114093Application Date: 2015-01-26
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Publication No.: US09657140B2Publication Date: 2017-05-23
- Inventor: Hyo Jun Park , Hak Gee Jung , Chang Sik Ha , Pradip Kumar Tapaswi , Young Sik Jeong
- Applicant: KOLON INDUSTRIES, INC.
- Applicant Address: KR Gwacheon-si
- Assignee: KOLON INDUSTRIES, INC.
- Current Assignee: KOLON INDUSTRIES, INC.
- Current Assignee Address: KR Gwacheon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2014-0009483 20140127; KR10-2014-0058606 20140515
- International Application: PCT/KR2015/000812 WO 20150126
- International Announcement: WO2015/111982 WO 20150730
- Main IPC: C08G73/10
- IPC: C08G73/10 ; C08L79/04 ; C08J5/18 ; C08G73/06 ; C08L79/08 ; C09D179/08

Abstract:
This invention relates to a polyimide and a film using the same and, more particularly, to a polyimide, which can exhibit a low dielectric constant while retaining the superior properties thereof, and can thus be utilized as electronic materials such as protective materials or insulating materials for liquid crystal displays or semiconductors, and optical communication materials such as optical waveguide materials, and to a polyimide film including the same.
Public/Granted literature
- US20160369054A1 POLYIMIDE AND FILM USING SAME Public/Granted day:2016-12-22
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