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公开(公告)号：US09657140B2
公开(公告)日：2017-05-23
申请号：US15114093
申请日：2015-01-26
Applicant: KOLON INDUSTRIES, INC.
Inventor： Hyo Jun Park , Hak Gee Jung , Chang Sik Ha , Pradip Kumar Tapaswi , Young Sik Jeong
CPC classification number: C08G73/1067 , C08G73/0633 , C08G73/10 , C08G73/1042 , C08G73/1075 , C08G73/1078 , C08G73/1085 , C08J5/18 , C08J2379/08 , C08L79/04 , C08L79/08 , C09D179/08
Abstract: This invention relates to a polyimide and a film using the same and, more particularly, to a polyimide, which can exhibit a low dielectric constant while retaining the superior properties thereof, and can thus be utilized as electronic materials such as protective materials or insulating materials for liquid crystal displays or semiconductors, and optical communication materials such as optical waveguide materials, and to a polyimide film including the same.
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公开(公告)号：US20140338959A1
公开(公告)日：2014-11-20
申请号：US14368998
申请日：2012-12-26
Applicant: KOLON INDUSTRIES, INC.
Inventor： Hak Gee Jung , Hyo Jun Park , Chul Ha Ju
CPC classification number: H05K1/0353 , C08J5/18 , C08J7/045 , C08J2379/08 , C08J2433/06 , C08J2475/04 , C08J2483/16 , G06F3/041 , G06F2203/04103 , H01B3/30 , H01B3/306 , H05K1/0274 , H05K1/092
Abstract: The present invention provides a plastic substrate, including: a polyimide film; a hard coating layer formed on one side of the polyimide film; and a transparent electrode layer formed on the other side of the polyimide film. The plastic substrate has excellent light transmittance high hardness characteristics, superior ITO proccessability and flexibility. Further, the plastic substrate can function as both a window film and an electrode film when it is applied to a touch screen panel. Thus, the present invention provides a touch screen panel which can be slimmed by reducing the number of laminated films including the plastic substrate.
Abstract translation: 本发明提供一种塑料基板，包括：聚酰亚胺膜; 形成在聚酰亚胺膜一侧的硬涂层; 以及形成在聚酰亚胺膜的另一侧的透明电极层。 塑料基材具有优异的透光性，高硬度特性，优异的ITO操作性和柔韧性。 此外，当将塑料基板应用于触摸屏面板时，塑料基板可用作窗膜和电极膜。 因此，本发明提供了一种触摸屏面板，其可以通过减少包括塑料基板的层叠膜的数量来减薄。
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公开(公告)号：US11130844B2
公开(公告)日：2021-09-28
申请号：US15540803
申请日：2015-12-31
Applicant: KOLON INDUSTRIES, INC.
Inventor： Jong Won Yang , Hak Gee Jung
Abstract: The present invention relates to a polyamide-imide precursor, a polyamide-imide obtained by imidizing the same, a polyamide-imide film, and an image display device including the film. The polyamide-imide precursor includes, in a molecular structure thereof, a first block, obtained by copolymerizing monomers including dianhydride and diamine, a second block, obtained by copolymerizing monomers including an aromatic dicarbonyl compound and the diamine, and a third block, obtained by copolymerizing monomers including the aromatic dicarbonyl compound and aromatic diamine. The dianhydride for forming the first block includes 2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), and the diamine for forming the first block and the second block includes 9,9-bis(3-fluoro-4-aminophenyl)fluorene (FFDA).
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公开(公告)号：US10526451B2
公开(公告)日：2020-01-07
申请号：US15739359
申请日：2016-06-27
Applicant: KOLON INDUSTRIES, INC.
Inventor： Chul Ha Ju , Hak Gee Jung , Hyo Jun Park
Abstract: Disclosed is a polyamide-imide precursor having a molecular structure in which a first polymer, derived from polymerization of a dianhydride and a diamine, and a second polymer, derived from polymerization of a diamine and an aromatic dicarbonyl compound, are copolymerized, wherein the diamine includes 3 to 50 mol % of at least one of 9,9-bis(4-aminophenyl)fluorene (FDA) and 9,9-bis(4-amino-3-fluorophenyl)fluorene (F-FDA), based on the total molar amount of the diamine. Also, a copolymerized polyamide-imide in which the polyamide-imide precursor is imidized or a copolymerized polyamide-imide film formed by an imidization reaction of the polyamide-imide precursor and an image display device including the copolymerized polyamide-imide film are provided.
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公开(公告)号：US11421081B2
公开(公告)日：2022-08-23
申请号：US17187055
申请日：2021-02-26
Applicant: KOLON INDUSTRIES, INC.
Inventor： Doo Li Choi , Hak Gee Jung
Abstract: A polyimide-polybenzoxazole precursor solution, a polyimide-polybenzoxazole film, and a method of manufacturing the film are disclosed. A polyimide-polybenzoxazole film manufactured using the polyimide-polybenzoxazole precursor solution is formed by copolymerizing a unit structure of diamine and dianhydride and a unit structure of diaminophenol and dicarbonyl chloride in an organic solvent. The film is colorless and transparent, like conventional polyimide films, and can exhibit improved heat resistance and low birefringence.
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Patent Agency Ranking
公开(公告)号：US11040522B2
公开(公告)日：2021-06-22
申请号：US14781829
申请日：2014-03-31
Applicant: KOLON INDUSTRIES, INC.
Inventor： Hak Yong Woo , Hak Gee Jung , Ki Il Hong
Abstract: Disclosed is a polyimide cover substrate, which is configured such that a device protection layer is formed of a urethane acrylate compound on at least one side of a polyimide film, thereby exhibiting not only high flexural properties and impact resistance but also superior solvent resistance, optical properties and scratch resistance and low water vapor transmission rate, and thus can be effectively utilized as a cover substrate for a flexible electronic device.
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公开(公告)号：US10662290B2
公开(公告)日：2020-05-26
申请号：US15540789
申请日：2015-12-30
Applicant: KOLON INDUSTRIES, INC.
Inventor： Jae Il Kim , Hak Gee Jung
Abstract: This invention relates to a polyamide-imide precursor, a polyamide-imide obtained by imidizing the same, a polyamide-imide film, and an image display device including the film. The polyamide-imide precursor includes, in a molecular structure thereof, a first block, obtained by copolymerizing monomers including dianhydride and diamine, and a second block, obtained by copolymerizing monomers including an aromatic dicarbonyl compound and aromatic diamine. The dianhydride includes biphenyltetracarboxylic acid dianhydride (BPDA) and 2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), and the diamine includes bistrifluoromethylbenzidine (TFDB).
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公开(公告)号：US20150152232A1
公开(公告)日：2015-06-04
申请号：US14411151
申请日：2013-06-27
Applicant: KOLON INDUSTRIES, INC.
Inventor： Chul Ha Ju , Hyo Jun Park , Hak Gee Jung
CPC classification number: C08J5/18 , C08G73/1003 , C08J2379/08 , C08K3/36 , C09D179/08
Abstract: This invention relates to polyimide, which includes amorphous silica particles having OH groups thereon and is thus highly heat-resistant, colorless and transparent, and to a polyimide film manufactured using the polyimide.
Abstract translation: 本发明涉及聚酰亚胺，其包括其上具有OH基的无定形二氧化硅颗粒，因此具有高耐热性，无色和透明性以及使用该聚酰亚胺制造的聚酰亚胺膜。
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9.发明授权Polyamide-imide copolymer film and method of preparing polyamide-imide copolymer 有权聚酰胺酰亚胺共聚物膜及聚酰胺 - 酰亚胺共聚物的制备方法公开(公告)号：US09018343B2
公开(公告)日：2015-04-28
申请号：US14347895
申请日：2012-09-27
Applicant: Kolon Industries, Inc.
Inventor： Hyo Jun Park , Hak Gee Jung
IPC: C08G69/26 , C08G73/14 , C08L79/08 , C08G73/10 , G02F1/1337
CPC classification number: C08G73/14 , C08G73/1039 , C08G73/1042 , C08G73/1067 , C08L79/08 , G02F1/133723
Abstract: Disclosed herein is a polyamide-imide copolymer film, comprising a copolymer resin in which a unit structure derived from TFDB (2,2′-bistrifluoromethyl-4,4′-biphenyl diamine), a unit structure derived from 6FDA (4,4′-(hexa-fluoroisopropylidene)diphthalic anhydride), a unit structure derived from BPDA (3,3′,4,4′-biphenyltetracarboxylic dianhydride) and a unit structure derived from TPC (terephthaloyl chloride or 1,4-benzenedicarbonyl chloride) are copolymerized, wherein the copolymer resin has a weight average molecular weight of 10,000˜400,000.
Abstract translation: 本文公开了一种聚酰胺 - 酰亚胺共聚物膜，其包含衍生自TFDB（2,2'-双三氟甲基-4,4'-联苯二胺）的单元结构的共聚物树脂，衍生自6FDA（4,4' - （六氟异亚丙基）二邻苯二甲酸酐），衍生自BPDA（3,3'，4,4'-联苯四羧酸二酐）的单元结构和衍生自TPC（对苯二甲酰氯或1,4-苯二甲酰氯）的单元结构共聚 其中共聚物树脂的重均分子量为10,000〜400,000。
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10.发明申请POLYAMIDE-IMIDE COPOLYMER FILM AND METHOD OF PREPARING POLYAMIDE-IMIDE COPOLYMER 有权聚酰亚胺共聚物薄膜和制备聚酰胺 - 共聚物的方法公开(公告)号：US20140243482A1
公开(公告)日：2014-08-28
申请号：US14347895
申请日：2012-09-27
Applicant: KOLON INDUSTRIES, INC.
Inventor： Hyo Jun Park , Hak Gee Jung
IPC: C08G73/14
CPC classification number: C08G73/14 , C08G73/1039 , C08G73/1042 , C08G73/1067 , C08L79/08 , G02F1/133723
Abstract: Disclosed herein is a polyamide-imide copolymer film, comprising a copolymer resin in which a unit structure derived from TFDB (2,2′-bistrifluoromethyl-4,4′-biphenyl diamine), a unit structure derived from 6FDA (4,4′-(hexa-fluoroisopropylidene)diphthalic anhydride), a unit structure derived from BPDA (3,3′,4,4′-biphenyltetracarboxylic dianhydride) and a unit structure derived from TPC (terephthaloyl chloride or 1,4-benzenedicarbonyl chloride) are copolymerized, wherein the copolymer resin has a weight average molecular weight of 10,000˜400,000.
Abstract translation: 本文公开了一种聚酰胺 - 酰亚胺共聚物膜，其包含衍生自TFDB（2,2'-双三氟甲基-4,4'-联苯二胺）的单元结构的共聚物树脂，衍生自6FDA（4,4' - （六氟异亚丙基）二邻苯二甲酸酐），衍生自BPDA（3,3'，4,4'-联苯四羧酸二酐）的单元结构和衍生自TPC（对苯二甲酰氯或1,4-苯二甲酰氯）的单元结构共聚 其中共聚物树脂的重均分子量为10,000〜400,000。
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