The present disclosure introduces pressure-equalized packaging for electronic sensors utilized in conjunction with downhole tools and/or other extreme environments. Such sensors may be operable to detect, sense, and/or measure a parameter, such as may be associated with the downhole tool, or pressurized fluid in which the downhole tool is at least partially submerged, or a subterranean formation adjacent the downhole tool. A housing couples the sensor to a component of the downhole tool. The housing includes an equalizer operable to substantially equalize a first pressure internal to the housing with a second pressure external to the housing.