- 专利标题: Multilayer ceramic component and board having the same
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申请号: US14860309申请日: 2015-09-21
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公开(公告)号: US09659710B2公开(公告)日: 2017-05-23
- 发明人: Heung Kil Park , Sang Soo Park
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si, Gyeonggi-Do
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si, Gyeonggi-Do
- 代理机构: McDermott Will & Emery LLP
- 优先权: KR10-2015-0009325 20150120
- 主分类号: H01G4/01
- IPC分类号: H01G4/01 ; H05K1/18 ; H01G4/30 ; H05K3/34 ; H01G2/06 ; H01G4/232
摘要:
A multilayer ceramic component includes a multilayer ceramic capacitor including a ceramic body including a plurality of first and second internal electrodes, and first and second external electrodes, first and second insulation frames respectively including first and second horizontal insulation portions and first and second vertical insulation portions, first and second external conductive electrodes including first and second horizontal conductive portions and first and second vertical conductive portions, first and second internal conductive electrodes disposed on internal surfaces of the first and second vertical insulation portions and connected to the first and second external electrodes, and electrical connection portions.
公开/授权文献
- US20160212843A1 MULTILAYER CERAMIC COMPONENT AND BOARD HAVING THE SAME 公开/授权日:2016-07-21