Invention Grant
- Patent Title: Package substrate comprising capacitor, redistribution layer and discrete coaxial connection
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Application No.: US14563854Application Date: 2014-12-08
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Publication No.: US09659850B2Publication Date: 2017-05-23
- Inventor: Hong Bok We , Kyu-Pyung Hwang , Young Kyu Song , Dong Wook Kim
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Loza & Loza LLP
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48 ; H05K1/16 ; H01L23/66 ; H01L23/482 ; H01L23/00
Abstract:
A package substrate that includes a first portion and a redistribution portion. The first portion is configured to operate as a capacitor. The first portion includes a first dielectric layer, a first set of metal layers in the dielectric layer, a first via in the dielectric layer, a second set of metal layers in the dielectric layer, and a second via in the dielectric layer. The first via is coupled to the first set of metal layers. The first via and the first set of metal layers are configured to provide a first electrical path for a ground signal. The second via is coupled to the second set of metal layers. The second via and the second set of metal layers are configured to provide a second electrical path for a power signal. The redistribution portion includes a second dielectric layer, and a set of interconnects.
Public/Granted literature
- US20160163628A1 PACKAGE SUBSTRATE COMPRISING CAPACITOR, REDISTRIBUTION LAYER AND DISCRETE COAXIAL CONNECTION Public/Granted day:2016-06-09
Information query
IPC分类:
