Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US14883732Application Date: 2015-10-15
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Publication No.: US09660098B2Publication Date: 2017-05-23
- Inventor: Sachiaki Tezuka , Tetsuhiro Tanaka , Toshihiko Takeuchi , Hideomi Suzawa , Suguru Hondo
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2012-230363 20121017; JP2012-252327 20121116; JP2013-052623 20130315
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/66 ; H01L21/28 ; H01L21/8234 ; H01L29/78 ; H01L29/49 ; H01L21/8238 ; H01L29/10 ; H01L29/423

Abstract:
Stable electrical characteristics and high reliability are provided for a miniaturized semiconductor device including an oxide semiconductor, and the semiconductor device is manufactured. The semiconductor device includes a base insulating layer; an oxide stack which is over the base insulating layer and includes an oxide semiconductor layer; a source electrode layer and a drain electrode layer over the oxide stack; a gate insulating layer over the oxide stack, the source electrode layer, and the drain electrode layer; a gate electrode layer over the gate insulating layer; and an interlayer insulating layer over the gate electrode layer. In the semiconductor device, the defect density in the oxide semiconductor layer is reduced.
Public/Granted literature
- US20160111546A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2016-04-21
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