Invention Grant
- Patent Title: High thermal conductivity Al—Mg—Fe—Si alloy for die casting
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Application No.: US14350079Application Date: 2012-10-09
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Publication No.: US09663847B2Publication Date: 2017-05-30
- Inventor: Ki Tae Kim , Je Sik Shin , Se Hyun Ko
- Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
- Applicant Address: KR Cheonan-si, Chungcheongnam-Do
- Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
- Current Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
- Current Assignee Address: KR Cheonan-si, Chungcheongnam-Do
- Agency: Revolution IP, PLLC
- Priority: KR10-2011-0103116 20111010
- International Application: PCT/KR2012/008161 WO 20121009
- International Announcement: WO2013/055074 WO 20130418
- Main IPC: C22C21/08
- IPC: C22C21/08 ; C22F1/047 ; C22C21/00
Abstract:
Disclosed is an aluminum alloy for die casting which comprises 1.0 weight % to 2.0 weight % of magnesium (Mg), 0.5 weight % to 1.6 weight % of iron (Fe), and 0.5 weight % to 0.9 weight % of silicon (Si), with the remainder being aluminum (Al) and inevitable impurities.
Public/Granted literature
- US20140234161A1 HIGH THERMAL CONDUCTIVITY Al-Mg-Fe-Si ALLOY FOR DIE CASTING Public/Granted day:2014-08-21
Information query
