- 专利标题: Silver and copper alloyed rivet contact
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申请号: US14784739申请日: 2013-12-13
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公开(公告)号: US09666382B2公开(公告)日: 2017-05-30
- 发明人: Masao Kuroda , Hiroshi Shirahata
- 申请人: Tanaka Kikinzoku Kogyo K.K.
- 申请人地址: JP Tokyo
- 专利权人: TANAKA KIKINZOKU KOGYO K.K.
- 当前专利权人: TANAKA KIKINZOKU KOGYO K.K.
- 当前专利权人地址: JP Tokyo
- 代理机构: Orrick Herrington & Sutcliffe, LLP
- 优先权: JP2013-096708 20130502
- 国际申请: PCT/JP2013/083420 WO 20131213
- 国际公布: WO2014/178155 WO 20141106
- 主分类号: H01H1/02
- IPC分类号: H01H1/02 ; H01H1/023 ; B32B15/01 ; B32B15/04 ; C22C5/08 ; H01H11/04 ; C22C5/06 ; C22C5/10 ; H01H1/025
摘要:
The present invention is a rivet contact including a head portion and a foot portion having a smaller width than the head portion, wherein the head portion contains a contact material layer having at least a top containing an Ag-based contact material; the rest of the head portion and the foot portion contain a base material containing Cu or a Cu alloy; and a barrier layer including an Ag alloy is provided at a junction interface between the contact material and the base material. Here, an Ag alloy obtained in such a manner that one or more base metal elements of Sn, In, Cu, Ni, Fe, Co, W, Mo, Zn, Cd, Te, and Bi are added to Ag by 0.03 to 20 mass % is preferably used as the Ag alloy constituting the barrier layer.
公开/授权文献
- US20160064157A1 RIVET CONTACT AND METHOD FOR PRODUCING SAME 公开/授权日:2016-03-03
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