An adsorption device for rotatable heating is provided with an adsorption heating plate, a support needle driving device, a rotary sliding ring, and a turning shaft. The adsorption heating plate is amounted at the top of the turning shaft, and a wafer is arranged at the top of the adsorption heating plate. The rotary sliding ring is connected to the turning shaft in which a vacuum channel and a connection wire channel are arranged. Support needles are connected to the output end of the support needle driving device, run through the adsorption heating plate, and are arranged at the bottom of the wafer uniformly. The adsorption device incorporates the wafer adsorption function, the wafer rotating function with controllable speed, and the heating function for heating the wafer to reach different temperatures, thereby providing adsorption and heating rotation at the same time.