Invention Grant
- Patent Title: Semiconductor device with encapsulant
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Application No.: US13664418Application Date: 2012-10-31
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Publication No.: US09666499B2Publication Date: 2017-05-30
- Inventor: Joachim Mahler , Edward Fuergut , Khalil Hosseini , Georg Meyer-Berg
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L21/56 ; H01L23/00
Abstract:
Described are techniques related to semiconductor devices that make use of encapsulant. In one implementation, a semiconductor device may be manufactured to include at least an encapsulant that includes at least glass particles.
Public/Granted literature
- US20140117531A1 SEMICONDUCTOR DEVICE WITH ENCAPSULANT Public/Granted day:2014-05-01
Information query
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