Invention Grant
- Patent Title: Process for production of sintered copper alloy sliding material and sintered copper alloy sliding material
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Application No.: US14168450Application Date: 2014-01-30
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Publication No.: US09669461B2Publication Date: 2017-06-06
- Inventor: Hitoshi Wada , Takashi Tomikawa , Daisuke Yoshitome , Hiromi Yokota
- Applicant: TAIHO KOGYO CO., LTD.
- Applicant Address: JP Toyota-shi
- Assignee: TAIHO KOGYO CO., LTD.
- Current Assignee: TAIHO KOGYO CO., LTD.
- Current Assignee Address: JP Toyota-shi
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2008-012403 20080123
- Main IPC: C22C9/02
- IPC: C22C9/02 ; B22F3/10 ; B22F1/00 ; C22C1/04 ; C22C9/00

Abstract:
Seizure resistance and wear resistance of Cu—Bi—In copper-alloy sliding material are enhanced by forming a soft phase of as pure as possible Bi. Mixed powder of Cu—In cuprous alloy powder and Cu—Bi containing Cu-based alloy powder is used. A sintering condition is set such that Bi moves outside particles of said Cu—Bi containing Cu-based powder and forms a Bi grain-boundary phase free of In, and In diffuses from said Cu—In containing Cu-based powder to said Cu—Bi containing Cu-based powder.
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