Invention Grant
- Patent Title: Light receptacle and light module
-
Application No.: US15111708Application Date: 2015-01-06
-
Publication No.: US09671573B2Publication Date: 2017-06-06
- Inventor: Shimpei Morioka , Kazutaka Shibuya
- Applicant: Enplas Corporation
- Applicant Address: JP Saitama
- Assignee: Enplas Corporation
- Current Assignee: Enplas Corporation
- Current Assignee Address: JP Saitama
- Agency: Brundidge & Stanger, P.C.
- Priority: JP2014-004967 20140115
- International Application: PCT/JP2015/050085 WO 20150106
- International Announcement: WO2015/107923 WO 20150723
- Main IPC: G02B6/32
- IPC: G02B6/32 ; G02B6/42 ; B29C45/40 ; H01S5/022 ; B29C45/00

Abstract:
This light receptacle comprises: first optical surfaces on which light beams emitted from light emitting elements are respectively caused to be incident; second optical surfaces which emit the light beams incident on first optical surfaces respectively toward the end faces of light transmission bodies; a third optical surface which reflects the light beams incident on the first optical surfaces toward the second optical surfaces; and recesses which are formed in the surface on which second optical surfaces are arranged. The distance between the centers of two adjacent first optical surfaces before mold release and the distance between the centers of two adjacent second optical surfaces before mold release during injection molding are shorter than the distance between the optical axes of light beams emitted from two adjacent light emitting elements that are arranged so as to face each other.
Public/Granted literature
- US20160327758A1 LIGHT RECEPTACLE AND LIGHT MODULE Public/Granted day:2016-11-10
Information query