Invention Grant
- Patent Title: High breakdown n-type buried layer
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Application No.: US15175192Application Date: 2016-06-07
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Publication No.: US09673273B2Publication Date: 2017-06-06
- Inventor: Sameer P. Pendharkar , Binghua Hu , Henry Litzmann Edwards
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Tuenlap D. Chan; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/02 ; H01L21/225 ; H01L21/265 ; H01L21/266 ; H01L21/324 ; H01L29/167 ; H01L21/74

Abstract:
A semiconductor device has an n-type buried layer formed by implanting antimony and/or arsenic into the p-type first epitaxial layer at a high dose and low energy, and implanting phosphorus at a low dose and high energy. A thermal drive process diffuses and activates both the heavy dopants and the phosphorus. The antimony and arsenic do not diffuse significantly, maintaining a narrow profile for a main layer of the buried layer. The phosphorus diffuses to provide a lightly-doped layer several microns thick below the main layer. An epitaxial p-type layer is grown over the buried layer.
Public/Granted literature
- US20160315141A1 High Breakdown N-Type Buried Layer Public/Granted day:2016-10-27
Information query
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