- 专利标题: Semiconductor component and process for fabricating a semiconductor component
-
申请号: US14420814申请日: 2013-08-12
-
公开(公告)号: US09673350B2公开(公告)日: 2017-06-06
- 发明人: Francois Boulard , Olivier Gravrand
- 申请人: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT
- 申请人地址: FR Paris
- 专利权人: Commissariat à l'énergie atomique et aux énergies alternatives
- 当前专利权人: Commissariat à l'énergie atomique et aux énergies alternatives
- 当前专利权人地址: FR Paris
- 代理机构: Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权: FR1257810 20120814
- 国际申请: PCT/EP2013/066779 WO 20130812
- 国际公布: WO2014/026941 WO 20140220
- 主分类号: H01L33/00
- IPC分类号: H01L33/00 ; H01L23/00 ; H01L33/46 ; H01L33/62 ; H01L27/146
摘要:
A semi-conducting component including a semi-conducting layer of a first conductivity type including a plurality of semi-conducting zones of a second conductivity type opposite that of the semi-conducting layer, and an insulating layer. The component further includes a first bias mechanism configured to bias the semi-conducting layer and a second bias mechanism configured to bias a semi-conducting zone. The first bias mechanism includes a conducting layer in contact with the insulating layer and which includes passageways for each second bias mechanism with the spacing between the conducting layer and the second bias mechanism which is located facing the corresponding semi-conducting zone.
公开/授权文献
信息查询
IPC分类: