Invention Grant
- Patent Title: Light emitting device package
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Application No.: US14953254Application Date: 2015-11-27
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Publication No.: US09673357B2Publication Date: 2017-06-06
- Inventor: Satoshi Ozeki , Yuichiro Tanda
- Applicant: LG Innotek Co., Ltd.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2014-0167951 20141128; KR10-2014-0167952 20141128
- Main IPC: H01L33/60
- IPC: H01L33/60 ; H01L33/62 ; H01L33/48 ; H01L33/46

Abstract:
An embodiment relates to a light-emitting device package. In an embodiment, the light-emitting device package includes a package body configured to include a top surface, a plate guide unit disposed on the top surface, and a cavity formed in the top surface, a light-emitting device disposed within the cavity, a plate disposed on the top surface of the package body and guided by the plate guide unit, and an adhesive member disposed between the top surface of the package body and the plate. The adhesive member includes a base layer made of a flexible material, a first adhesive tape disposed between the base layer and the top surface of the package body and bonded to the base layer and the top surface of the package body, and a second adhesive tape disposed between the base layer and the plate and bonded to the base layer and the plate.
Public/Granted literature
- US20160155907A1 LIGHT EMITTING DEVICE PACKAGE Public/Granted day:2016-06-02
Information query
IPC分类: