Invention Grant
- Patent Title: Heterogeneous integration of microfluidic devices in package structures
-
Application No.: US13624288Application Date: 2012-09-21
-
Publication No.: US09674945B2Publication Date: 2017-06-06
- Inventor: Weng Hong Teh , Kevin Lin , Feras Eid , Qing Ma
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Winkle, PLLC
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H05K1/02 ; H01L25/00 ; H05K1/18 ; H05K3/00
Abstract:
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a microfluidic die to a package structure, wherein the microfluidic die comprises a plurality of asymmetric electrodes that may be coupled with signal pads disposed within the package structure.
Public/Granted literature
- US20140083858A1 HETEROGENEOUS INTEGRATION OF MICROFLUIDIC DEVICES IN PACKAGE STRUCTURES Public/Granted day:2014-03-27
Information query
IPC分类:
