Invention Grant
- Patent Title: Printed circuit boards and semiconductor packages
-
Application No.: US14596770Application Date: 2015-01-14
-
Publication No.: US09674958B2Publication Date: 2017-06-06
- Inventor: Sang-hun Jeon , Ho-jin Chun , Hyun-seok Cha , Jae-hoon Heo , Young-deok Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Ward and Smith, P.A.
- Priority: KR10-2014-0068580 20140605
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/18 ; H05K7/00 ; G11C5/06 ; H01L23/00 ; H01L25/18 ; H05K1/02 ; H05K3/46 ; H01L23/538

Abstract:
A printed circuit board includes an in-line PCB region comprising an input/output control region including a first conductive line, and a main PCB region coupled to the in-line PCB region and comprising a semiconductor chip and an input/output signal generation region including a second conductive line. The input/output signal generation region is configured to detect whether or not the first and second conductive lines are electrically connected and to provide an input/output control signal to the semiconductor chip in response to determining whether or not the first and second conductive lines are electrically connected.
Public/Granted literature
- US20150357275A1 Printed Circuit Boards and Semiconductor Packages Public/Granted day:2015-12-10
Information query