Invention Grant
- Patent Title: Print head die with thermal control
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Application No.: US15339715Application Date: 2016-10-31
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Publication No.: US09676190B2Publication Date: 2017-06-13
- Inventor: Garrett E. Clark , Chris Bakker , Mark H. MacKenzie , Glenn D. McCloy
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc.—Patent Department
- Main IPC: B41J2/15
- IPC: B41J2/15 ; B41J2/14

Abstract:
A print head die may include a substrate, an electrical connector and at least three liquid feed slots. The electrical connector is on a first side of the substrate and extends along the major dimension of the substrate. The electrical connector is connectable directly to an electrical interconnect to connect the print head die to a controller. The at least three liquid feed slots are formed in the substrate and extend along the major dimension of the substrate. Wherein at least one and less than all of the at least three liquid feed slots has an associated temperature sensor connected to the electrical connector.
Public/Granted literature
- US20170050436A1 PRINT HEAD DIE WITH THERMAL CONTROL Public/Granted day:2017-02-23
Information query
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