Invention Grant
- Patent Title: Substrate conveyance apparatus and substrate peeling system
-
Application No.: US14182969Application Date: 2014-02-18
-
Publication No.: US09679798B2Publication Date: 2017-06-13
- Inventor: Yasuharu Iwashita , Osamu Hirakawa , Yasutaka Soma , Takeshi Tamura , Kazutaka Noda , Xavier Francois Brun , Charles Wayne Singleton, Jr.
- Applicant: Tokyo Electron Limited , Intel Corporation
- Applicant Address: JP Tokyo US CA Santa Clara
- Assignee: Tokyo Electron Limited,Intel Corporation
- Current Assignee: Tokyo Electron Limited,Intel Corporation
- Current Assignee Address: JP Tokyo US CA Santa Clara
- Agency: Abelman, Frayne & Schwab
- Priority: JP2013-032521 20130221
- Main IPC: B32B38/10
- IPC: B32B38/10 ; H01L21/683 ; B32B43/00

Abstract:
Disclosed is a substrate conveyance apparatus capable of suppressing a substrate from being damaged. The substrate conveyance apparatus includes a plurality of nozzles, and a main body unit. The plurality of nozzles are configured to jet a gas toward a surface of a substrate to hold the substrate in a non-contact manner. The main body unit is provided with the plurality of nozzles. At least surfaces of the plurality of nozzles are formed of a resin.
Public/Granted literature
- US20140234033A1 SUBSTRATE CONVEYANCE APPARATUS AND SUBSTRATE PEELING SYSTEM Public/Granted day:2014-08-21
Information query