An integrated circuit (IC) package that includes a first die, a wire bond coupled to the first die, a first encapsulation layer that at least partially encapsulates the first die and the wire bond, a second die, a redistribution portion coupled to the second die, and a second encapsulation layer that at least partially encapsulates the second die. In some implementations, the wire bond is coupled to the redistribution portion. In some implementations, the integrated circuit (IC) package further includes a package interconnect that is at least partially encapsulated by the second encapsulation layer. In some implementations, the integrated circuit (IC) package further includes a via that is at least partially encapsulated by the second encapsulation layer. In some implementations, the integrated circuit (IC) package has a height of about 500 microns (μm) or less.