Invention Grant
- Patent Title: Solid-state imaging device, method of manufacturing a solid-state imaging device, and electronic apparatus
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Application No.: US14993851Application Date: 2016-01-12
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Publication No.: US09679932B2Publication Date: 2017-06-13
- Inventor: Nanako Kato , Toshifumi Wakano
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2013-231975 20131108
- Main IPC: H01L27/146
- IPC: H01L27/146
Abstract:
Provided is a solid-state imaging device including a lamination-type backside illumination CMOS (Complementary Metal Oxide Semiconductor) image sensor having a global shutter function. The solid-state imaging device includes a separation film including one of a light blocking film and a light absorbing film between a memory and a photo diode.
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