Invention Grant
- Patent Title: Miniature surface mount device with large pin pads
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Application No.: US13153888Application Date: 2011-06-06
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Publication No.: US09685592B2Publication Date: 2017-06-20
- Inventor: Chi Keung Chan , Chak Hau Pang , Fei Hong Li , Yue Kwong Lau , Jun Zhang , David Todd Emerson
- Applicant: Chi Keung Chan , Chak Hau Pang , Fei Hong Li , Yue Kwong Lau , Jun Zhang , David Todd Emerson
- Applicant Address: CN
- Assignee: Cree Huizhou Solid State Lighting Company Limited
- Current Assignee: Cree Huizhou Solid State Lighting Company Limited
- Current Assignee Address: CN
- Agency: Brinks Gilson & Lione
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L33/62 ; H01L23/498 ; H01L25/075 ; H01L33/64
Abstract:
One embodiment of the surface mount LED package includes a lead frame and a plastic casing at least partially encasing the lead frame. The lead frame includes a plurality of electrically conductive chip carriers. There is an LED disposed on each one of the plurality of electrically conductive chip carriers. A profile height of the surface mount LED package is less than about 1.0 mm.
Public/Granted literature
- US20120104427A1 MINIATURE SURFACE MOUNT DEVICE WITH LARGE PIN PADS Public/Granted day:2012-05-03
Information query
IPC分类:
