Invention Grant
- Patent Title: Printed circuit board and method of manufacturing printed circuit board
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Application No.: US14753512Application Date: 2015-06-29
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Publication No.: US09686869B2Publication Date: 2017-06-20
- Inventor: Hiroyuki Tanabe , Hitoki Kanagawa
- Applicant: Nitto Denko Corporation
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Panitch Schwarze Belisario & Nadel LLP
- Priority: JP2014-134901 20140630
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/03 ; H05K1/00 ; H05K1/16 ; H05K3/28 ; H05K3/24
Abstract:
A write wiring trace is formed over insulating layer. A coating layer, being directly in contact with at least a first portion of a surface of the write wiring trace, is formed over the insulating layer to cover the write wiring trace. A connection terminal is formed over the insulating layer to be electrically connected to the write wiring trace and exposed from the coating layer.
Public/Granted literature
- US20150382451A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD Public/Granted day:2015-12-31
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