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公开(公告)号：US10524363B2
公开(公告)日：2019-12-31
申请号：US15628059
申请日：2017-06-20
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu Sugimoto , Hiroyuki Tanabe , Yoshito Fujimura
Abstract: A method includes the following steps: S1, providing the insulating layer having an inclined face; S4, disposing a photomask so that in the photoresist, first and second exposure portions are exposed to light, and exposing the photoresist is to light through the photomask; S5, removing the first and the second exposure portions of the photoresist. On the assumption that in S4, light reflected at the metal thin film is focused between the first and the second exposure portions of the photoresist, the inclined face has a bending portion bending in one direction, the portion removed in S5 in the photoresist due to light focus being continuous with the first and the second exposure portions. The second exposure portion includes continuously an avoidance portion that avoids the bending portion and an overlapping portion that overlaps with at least a portion other than the bending portion in the inclined face.
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公开(公告)号：US10201077B2
公开(公告)日：2019-02-05
申请号：US15208655
申请日：2016-07-13
Applicant: Nitto Denko Corporation
Inventor： Yuu Sugimoto , Hiroyuki Tanabe , Naohiro Terada
Abstract: A suspension board and an inspection substrate are integrally supported by a support frame. In the suspension board, first and second insulating layers are laminated on a support substrate in this order. Part of a line is formed on the first insulating layer, and the remaining line is formed on the second insulating layer. A via connecting the part of the line to the remaining line is formed in the second insulating layer. In the inspection substrate, the first and second insulating layers are laminated on the support substrate in this order. A first inspection conductor layer is formed on the first insulating layer, and a second inspection conductor layer is formed on the second insulating layer. A via connecting the first inspection conductor layer to the second inspection conductor layer is formed in the second insulating layer.
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公开(公告)号：US10172234B2
公开(公告)日：2019-01-01
申请号：US15386755
申请日：2016-12-21
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu Sugimoto , Hiroyuki Tanabe
Abstract: The wired circuit board includes an insulating layer and a conductive pattern provided on the insulating layer. The insulating layer has an inclined face and a flat face, and a supplementary angle y to an angle formed by the inclined face and the flat face is more than 0 degree and 20 degrees or less.
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公开(公告)号：US09686869B2
公开(公告)日：2017-06-20
申请号：US14753512
申请日：2015-06-29
Applicant: Nitto Denko Corporation
Inventor： Hiroyuki Tanabe , Hitoki Kanagawa
Abstract: A write wiring trace is formed over insulating layer. A coating layer, being directly in contact with at least a first portion of a surface of the write wiring trace, is formed over the insulating layer to cover the write wiring trace. A connection terminal is formed over the insulating layer to be electrically connected to the write wiring trace and exposed from the coating layer.
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公开(公告)号：US09565751B2
公开(公告)日：2017-02-07
申请号：US14877424
申请日：2015-10-07
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu Sugimoto , Hiroyuki Tanabe
CPC classification number: H05K1/0271 , G11B5/484 , G11B5/4853 , H05K1/056 , H05K3/4685 , H05K2201/09245 , H05K2203/0323
Abstract: A suspension board with circuit includes a metal supporting board, a first insulating layer including a disposing portion formed at one side in a thickness direction of the metal supporting board, a first conductive layer including a first wire portion formed at the one side of the first insulating layer, a second insulating layer including a covering portion covering the first wire portion, and a second conductive layer including a second wire portion formed at the one side of the second insulating layer and a terminal portion connected to the first or second wire portion. The second insulating layer includes a second terminal supporting portion formed at the other of the terminal portion. The first insulating layer includes a first terminal supporting portion formed at the other side of the second terminal supporting portion. The metal supporting board is not formed at the other side thereof.
Abstract translation: 具有电路的悬挂板包括金属支撑板，第一绝缘层，包括形成在金属支撑板的厚度方向上的一侧的布置部分;第一导电层，包括形成在第一导电层的一侧的第一导线部分 绝缘层，包括覆盖第一导线部分的覆盖部分的第二绝缘层，以及包括形成在第二绝缘层一侧的第二导线部分和连接到第一或第二导线部分的端子部分的第二导电层。 第二绝缘层包括形成在端子部分另一端的第二端子支撑部分。 第一绝缘层包括形成在第二端子支撑部分的另一侧的第一端子支撑部分。 金属支撑板不形成在其另一侧。
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Patent Agency Ranking
公开(公告)号：US10524355B2
公开(公告)日：2019-12-31
申请号：US15488808
申请日：2017-04-17
Applicant: Nitto Denko Corporation
Inventor： Daisuke Yamauchi , Hiroyuki Tanabe
Abstract: In a suspension board, a ground layer and a first insulating layer are formed on a support substrate. The ground layer has electric conductivity higher than that of the support substrate. A power wiring trace is formed on the first insulating layer. A second insulating layer is formed on the support substrate to cover the ground layer and the first insulating layer. A write wiring trace is formed on the second insulating layer to at least partially overlap with the ground layer. A distance between the ground layer and the write wiring trace in a stacking direction of the support substrate, the first insulating layer and the second insulating layer is set larger than a distance between the power wiring trace and the write wiring trace in the stacking direction.
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公开(公告)号：US10074389B2
公开(公告)日：2018-09-11
申请号：US15800692
申请日：2017-11-01
Applicant: NITTO DENKO CORPORATION
Inventor： Daisuke Yamauchi , Hiroyuki Tanabe
CPC classification number: G11B5/486 , G11B5/484 , H05K1/0242 , H05K1/028 , H05K2201/09236
Abstract: A wired circuit board includes an insulating layer and a plurality of wires disposed at one-side surface in a thickness direction of the insulating layer at spaced intervals to each other. The plurality of wires have one pair of wires in parallel, the plurality of wires continuously have a first portion and a second portion in which the total sum of a line width of one wire of one pair of wires and an interval between one pair of wires is smaller than that of the first portion, and a thickness T1 of the first portion is large with respect to a thickness T2 of the second portion.
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公开(公告)号：US10021780B2
公开(公告)日：2018-07-10
申请号：US15800680
申请日：2017-11-01
Applicant: NITTO DENKO CORPORATION
Inventor： Daisuke Yamauchi , Hiroyuki Tanabe
CPC classification number: H05K1/028 , G11B5/484 , H05K1/056 , H05K3/064 , H05K3/18 , H05K3/243 , H05K2201/0191 , H05K2201/0347 , H05K2201/09736 , H05K2203/0353
Abstract: A wired circuit board includes an insulating layer and a conductive layer. The insulating layer continuously has a first insulating portion, a second insulating portion having a thickness smaller than that of the first insulating portion, and a third insulating portion disposed between the first insulating portion and the second insulating portion and having a thickness that gradually becomes smaller from the first insulating portion toward the second insulating portion. The conductive layer continuously has a first conductive portion disposed at one-side surface of the first insulating portion and a second conductive portion disposed at one-side surface of the second insulating portion and having a thickness smaller than that of the first conductive portion. The first conductive portion is disposed at one-side surface of the second insulating portion and the third insulating portion or is disposed at one-side surface of the first insulating portion and the third insulating portion.
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公开(公告)号：US09949370B2
公开(公告)日：2018-04-17
申请号：US15373583
申请日：2016-12-09
Applicant: NITTO DENKO CORPORATION
Inventor： Hiroyuki Tanabe , Naohiro Terada , Yuu Sugimoto , Daisuke Yamauchi
CPC classification number: H05K1/05 , G11B5/483 , G11B5/4853 , H05K1/117 , H05K3/22 , H05K3/3442 , H05K3/4608 , H05K3/4644 , H05K2201/10151 , H05K2201/10227 , Y02P70/613
Abstract: A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, a conductor layer disposed at the one side of the base insulating layer and including a connecting terminal electrically connected to a slider, a cover insulating layer covering the conductor layer to expose the connecting terminal and disposed at the one side of the base insulating layer, and a plating layer covering the connecting terminal. The cover insulating layer includes a first cover insulating layer disposed at the one side of the base insulating layer and a second cover insulating layer disposed at the one side of the first cover insulating layer, and the thickness of the plating layer is not more than the total sum of the thickness of the first cover insulating layer and that of the second cover insulating layer.
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公开(公告)号：US09940957B2
公开(公告)日：2018-04-10
申请号：US15223241
申请日：2016-07-29
Applicant: Nitto Denko Corporation
Inventor： Daisuke Yamauchi , Hiroyuki Tanabe
CPC classification number: G11B5/4833 , G11B5/484 , H05K1/056 , H05K1/09 , H05K1/111 , H05K3/244 , H05K3/388 , H05K2201/0341 , H05K2201/0347 , H05K2201/05 , Y02P70/611
Abstract: A conductor trace is formed on a base insulating layer. The conductor trace includes two terminal portions and one wiring portion. The wiring portion is formed to connect the two terminal portions to each other and extend from each terminal portion. A metal cover layer is formed to cover the terminal portion and the wiring portion of the conductor trace and continuously extend from a surface of the terminal portion to a surface of the wiring portion. The metal cover layer is made of metal having magnetism lower than magnetism of nickel, and is made of gold, for example. A cover insulating layer is formed on the base insulating layer to cover a portion, of the metal cover layer formed on the conductor trace, covering the wiring portion and not to cover a portion of the metal cover layer covering the terminal portion.
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