- 专利标题： Method of forming a microelectronic device package
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申请号： US14566198申请日： 2014-12-10
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公开(公告)号： US09686870B2公开(公告)日： 2017-06-20
- 发明人: Weng Hong Teh , John S. Guzek
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Winkle, PLLC
- 主分类号： H05K3/32
- IPC分类号： H05K3/32 ; H01L23/31 ; H01L21/56 ; H01L23/00 ; H01L21/683
摘要：
The present disclosure relates to the field of fabricating microelectronic device packages and, more particularly, to microelectronic device packages having bumpless build-up layer (BBUL) designs, wherein at least one secondary device is disposed within the thickness (i.e. the z-direction or z-height) of the microelectronic device of the microelectronic device package.
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