Invention Grant
- Patent Title: Package MEMS switch and method
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Application No.: US14368771Application Date: 2013-12-17
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Publication No.: US09691579B2Publication Date: 2017-06-27
- Inventor: Qing Ma , Johanna Swan , Valluri Rao , Feras Eid
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- International Application: PCT/US2013/075764 WO 20131217
- International Announcement: WO2015/094184 WO 20150625
- Main IPC: H01H59/00
- IPC: H01H59/00 ; H01Q5/314 ; H01H50/00
Abstract:
An electronic device and methods including a switch formed in a chip package are shown. An electronic device and methods including a switch formed in a polymer based dielectric are shown. Examples of switches shown include microelectromechanical system (MEMS) structures, such as cantilever switches and/or shunt switches.
Public/Granted literature
- US20160020051A1 PACKAGE MEMS SWITCH AND METHOD Public/Granted day:2016-01-21
Information query
