- 专利标题： High conductivity electrostatic chuck
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申请号： US13818339申请日： 2011-09-08
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公开(公告)号： US09692325B2公开(公告)日： 2017-06-27
- 发明人: David Suuronen , Lyudmila Stone , Julian Blake , Dale K. Stone , Richard A. Cooke , Steven Donnell , Chandra Venkatraman
- 申请人： David Suuronen , Lyudmila Stone , Julian Blake , Dale K. Stone , Richard A. Cooke , Steven Donnell , Chandra Venkatraman
- 申请人地址： US MA Billerica US MA Gloucester
- 专利权人： Entegris, Inc.,Varian Semiconductor Equipment Associates, Inc.
- 当前专利权人： Entegris, Inc.,Varian Semiconductor Equipment Associates, Inc.
- 当前专利权人地址： US MA Billerica US MA Gloucester
- 代理机构： Hamilton, Brook, Smith & Reynolds, P.C.
- 国际申请： PCT/US2011/050841 WO 20110908
- 国际公布： WO2012/033922 WO 20120315
- 主分类号： H01L21/683
- IPC分类号： H01L21/683 ; H02N13/00 ; B23Q3/152
摘要：
In accordance with an embodiment of the invention, there is provided an electrostatic chuck comprising a conductive path covering at least a portion of a workpiece-contacting surface of a gas seal ring of the electrostatic chuck, the conductive path comprising at least a portion of an electrical path to ground; and a main field area of a workpiece-contacting surface of the electrostatic chuck comprising a surface resistivity in the range of from about 108 to about 1012 ohms per square.
公开/授权文献
- US20130155569A1 High Conductivity Electrostatic Chuck 公开/授权日：2013-06-20
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