Individual finger isolation through spot application of a dielectric in an optoelectronic device
摘要:
An optoelectronic device including at least one of a solar device, a semiconductor device, and an electronic device. The device includes a semiconductor unit. A plurality of metal fingers is disposed on a surface of the semiconductor unit for electrical conduction. Each of the metal fingers corresponds to a section of the optoelectronic device. A plurality of pad areas is available for connection to a bus bar, wherein each of the metal fingers is connected to a corresponding pad area for forming an electrical contact. The optoelectronic device includes a bad section, wherein the bad section is associated with a compromised metal finger and a compromised pad area. A dielectric spot coating is disposed above the compromised pad area to electrically isolate the bad section.
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