- Patent Title: Fastenerless hinge which enables thin form factor low cost design
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Application No.: US14752938Application Date: 2015-06-27
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Publication No.: US09703327B2Publication Date: 2017-07-11
- Inventor: Mark E. Sprenger , Kenan Arik , Drew G. Damm
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Law Office of Herbert T. Patty
- Agent Herbert Patty
- Main IPC: G06F1/16
- IPC: G06F1/16 ; E05D7/10

Abstract:
The present disclosure includes a fastenerless hinge system which enables a thin form factor low cost design. A hinge system described herein may include a hinge bracket and a hinge wing. The hinge bracket includes an elevated portion thereby providing a hollow region and one or more spring tabs. The hinge wing is slidably coupled to the hinge bracket through the hollow portion. Advantageously, a hinge system consistent with the present disclosure does not include fasteners such that the “Z” height of the computing device may be minimized in addition to reducing costs.
Public/Granted literature
- US20160378146A1 Fastenerless Hinge which Enables Thin Form Factor Low Cost Design Public/Granted day:2016-12-29
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