- 专利标题： Substrate for electronic device and electronic device
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申请号： US13313823申请日： 2011-12-07
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公开(公告)号： US09704793B2公开(公告)日： 2017-07-11
- 发明人: Shigenobu Sekine , Yurina Sekine
- 申请人： Shigenobu Sekine , Yurina Sekine
- 申请人地址： JP Tokyo
- 专利权人： NAPRA CO., LTD.
- 当前专利权人： NAPRA CO., LTD.
- 当前专利权人地址： JP Tokyo
- 代理机构： Westerman, Hattori, Daniels & Adrian, LLP
- 优先权： JP2011-000241 20110104; JP2011-007519 20110118; JP2011-015280 20110127; JP2011-034205 20110221; JP2011-057542 20110316; JP2011-092717 20110419; JP2011-118077 20110526
- 主分类号： H05K1/03
- IPC分类号： H05K1/03 ; H01L23/498 ; H01L21/48 ; H01L23/367 ; H01L33/64 ; H01L33/48
摘要：
A substrate includes a plurality of through electrodes. The through electrode has a nanocomposite structure including a nm-sized carbon nanotube and is a casting formed by using a via formed in the substrate as a mold.
公开/授权文献
- US20120168206A1 SUBSTRATE FOR ELECTRONIC DEVICE AND ELECTRONIC DEVICE 公开/授权日：2012-07-05
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