Invention Grant
- Patent Title: Waterfall wire bonding
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Application No.: US14118485Application Date: 2011-05-18
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Publication No.: US09704797B2Publication Date: 2017-07-11
- Inventor: Zhong Lu , Fen Yu , Chin Tien Chiu , Cheeman Yu , Fuqiang Xiao
- Applicant: Zhong Lu , Fen Yu , Chin Tien Chiu , Cheeman Yu , Fuqiang Xiao
- Applicant Address: CN Shanghai
- Assignee: SanDisk Information Technology (Shanghai) Co., Ltd.
- Current Assignee: SanDisk Information Technology (Shanghai) Co., Ltd.
- Current Assignee Address: CN Shanghai
- Agency: Vierra Magen Marcus LLP
- International Application: PCT/CN2011/074234 WO 20110518
- International Announcement: WO2012/155345 WO 20121122
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/498 ; H01L25/065 ; H01L25/00 ; H01L21/768
Abstract:
A wire bonded structure for a semiconductor device is disclosed. The wire bonded structure comprises a bonding pad; and a continuous length of wire mutually diffused with the bonding pad, the wire electrically coupling the bonding pad with a first electrical contact and a second electrical contact different from the first electrical contact.
Public/Granted literature
- US20140183727A1 WATERFALL WIRE BONDING Public/Granted day:2014-07-03
Information query
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