Invention Grant
- Patent Title: System for installing removable external component in electronic devices
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Application No.: US14881323Application Date: 2015-10-13
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Publication No.: US09706676B2Publication Date: 2017-07-11
- Inventor: Hee-Cheul Moon , Kwon-Ho Son
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Cha & Reiter, LLC
- Priority: KR10-2014-0140568 20141017
- Main IPC: H01R13/629
- IPC: H01R13/629 ; H05K7/14 ; H04B1/3816 ; H04B1/3818 ; F16B1/00 ; H01Q1/12 ; H05K5/03
Abstract:
An electronic device comprising: an housing; a tray detachably disposed in a slot formed in the housing, wherein the tray includes: a mounting portion adapted to receive a removable external component, a tray cover having a surface facing an exterior of the housing, and a connector formed between the mounting portion and the tray cover.
Public/Granted literature
- US20160113142A1 SYSTEM FOR INSTALLING REMOVABLE EXTERNAL COMPONENT IN ELECTRONIC DEVICES Public/Granted day:2016-04-21
Information query
