Invention Grant
- Patent Title: Electronic component mounting system and electronic component mounting method
-
Application No.: US13578364Application Date: 2012-03-02
-
Publication No.: US09706695B2Publication Date: 2017-07-11
- Inventor: Shuzo Yagi , Takashi Tamura , Hiroki Yamamoto , Toru Ikeda , Kazuhiro Kishikawa
- Applicant: Shuzo Yagi , Takashi Tamura , Hiroki Yamamoto , Toru Ikeda , Kazuhiro Kishikawa
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon, LLP
- International Application: PCT/JP2012/001464 WO 20120302
- International Announcement: WO2013/014823 WO 20130131
- Main IPC: H05K13/04
- IPC: H05K13/04

Abstract:
In an electronic component mounting system 1 configured by coupling electronic component mounting devices M1 to M4A each having a first substrate transport mechanism 12A and a second substrate transport mechanism 12B together, the electronic component mounting device M4A includes a first tray feeder 20A that stores an electronic component extracted by a first mounting head 15A of a component mounting mechanism as a first work operation mechanism, and a second tray feeder 20B that stores an electronic component extracted by a second mounting head 15B of a component mounting mechanism as a second work operation mechanism.
Public/Granted literature
- US20130047427A1 ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD Public/Granted day:2013-02-28
Information query