- 专利标题: Methods of forming hetero-layers with reduced surface roughness and bulk defect density of non-native surfaces and the structures formed thereby
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申请号: US13997607申请日: 2011-12-28
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公开(公告)号: US09711591B2公开(公告)日: 2017-07-18
- 发明人: Niloy Mukherjee , Matthew V. Metz , James M. Powers , Van H. Le , Benjamin Chu-Kung , Mark R. Lemay , Marko Radosavljevic , Niti Goel , Loren Chow , Peter G. Tolchinsky , Jack T. Kavalieros , Robert S. Chau
- 申请人: Niloy Mukherjee , Matthew V. Metz , James M. Powers , Van H. Le , Benjamin Chu-Kung , Mark R. Lemay , Marko Radosavljevic , Niti Goel , Loren Chow , Peter G. Tolchinsky , Jack T. Kavalieros , Robert S. Chau
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Blakely, Sokoloff, Taylor & Zafman LLP
- 国际申请: PCT/US2011/067661 WO 20111228
- 国际公布: WO2013/101001 WO 20130704
- 主分类号: H01L21/02
- IPC分类号: H01L21/02 ; H01L29/06
摘要:
Methods of forming hetero-layers with reduced surface roughness and bulk defect density on non-native surfaces and the devices formed thereby are described. In one embodiment, the method includes providing a substrate having a top surface with a lattice constant and depositing a first layer on the top surface of the substrate. The first layer has a top surface with a lattice constant that is different from the first lattice constant of the top surface of the substrate. The first layer is annealed and polished to form a polished surface. A second layer is then deposited above the polished surface.
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