A light emitting device includes a light emitting element and a package. The package includes a first lead frame, a second lead frame, and a resin. The first lead frame has a first surface on which the light emitting element is provided. The first lead frame has a first overlap portion. The second lead frame is spaced apart from the first lead frame and has a second overlap portion. The first overlap portion and the second overlap portion overlap at an overlap position so that the first lead frame extends from the overlap position toward a first direction and a second direction opposite to the first direction and so that the second lead frame extend from the overlap position toward a third direction and a fourth direction opposite to the third direction as viewed along a line substantially perpendicular to the first surface.