-
公开(公告)号：US10153411B2
公开(公告)日：2018-12-11
申请号：US15823575
申请日：2017-11-28
Applicant: NICHIA CORPORATION
Inventor： Ryoji Naka , Atsushi Bando , Tomohide Miki , Kimihiro Miyamoto
Abstract: A light emitting device includes a package having a recess which includes a bottom surface and an inner peripheral surface around a periphery of the bottom surface. The package includes a first lead to define a first part of the bottom surface, a second lead to define a second part of the bottom surface, and a resin body to provide the inner peripheral surface and a remaining part of the bottom surface. The bottom surface includes a light emitting element mounting region in the first part and a groove surrounding the light emitting element mounting region. A light emitting element is mounted on the light emitting element mounting region. A light-transmissive resin is provided in the recess to be in at least a part of a groove surface. A light reflecting resin is provided between the inner peripheral surface of the recess and the light-transmissive resin.
-
公开(公告)号：US11094871B2
公开(公告)日：2021-08-17
申请号：US16816435
申请日：2020-03-12
Applicant: NICHIA CORPORATION
Inventor： Kimihiro Miyamoto , Tomoyuki Sato
Abstract: A light-emitting module 1 includes a light-emitting element, a mounting board, a module board, an anode connection member, a cathode connection member, and a metal ribbon. The light-emitting element includes an anode electrode and a cathode electrode. The mounting board includes an anode pad, a cathode pad and a heat radiating pads, each of which is electrically independent. The anode electrode and the anode pad are connected. The cathode electrode and the cathode pad are connected. The module board includes an anode terminal, a cathode terminal and a heat sink. The anode connection member connects the anode pad and the anode terminal. The cathode connection member connects the cathode pad and the cathode terminal. The metal ribbon connects the heat radiating pads and the heat sink.
-
公开(公告)号：US10367121B2
公开(公告)日：2019-07-30
申请号：US15833644
申请日：2017-12-06
Applicant: NICHIA CORPORATION
Inventor： Tadaaki Ikeda , Masaki Hayashi , Koji Abe , Kimihiro Miyamoto
Abstract: A method of manufacturing a package, the method comprising the steps of: preparing a resin compact having a recess, and including a pair of leads arranged at a bottom surface of the recess, a first resin body forming a lateral wall of the recess, and a second resin body arranged between the pair of leads; forming a reflective film entirely on at least the bottom surface of the recess and an inner surface of the lateral wall of the recess; and removing the reflective film formed on the pair of leads in the recess in the resin compact on which the reflective film has been formed.
-
公开(公告)号：US10529700B2
公开(公告)日：2020-01-07
申请号：US16100210
申请日：2018-08-10
Applicant: NICHIA CORPORATION
Inventor： Kimihiro Miyamoto , Atsushi Bando , Naofumi Sumitani , Akira Otani
IPC: H01L25/16 , H01L33/60 , H01L25/075 , H01L33/54 , H01L33/48 , H01L33/50 , H01L33/56 , H01L33/62 , H01L29/866
Abstract: A light emitting device includes a package having a recess which includes a bottom surface having corners. The package includes a first electrode, a second electrode, and a resin portion. The first electrode is provided at a first part of the bottom surface. The second electrode is provided at a second part of the bottom surface. The resin portion is provided between the first electrode and the second electrode at a third part of the bottom surface. A protection element is provided on the bottom surface. A light reflective material covers the bottom surface except for an uncovered region to cover the protection element and the corners of the bottom surface and uncovers an uncovering region of the bottom surface. The uncovered region is defined by linear lines and curved lines connecting the linear lines. A light emitting element is provided in the uncovered region on the bottom surface.
-
公开(公告)号：US09865779B2
公开(公告)日：2018-01-09
申请号：US15278724
申请日：2016-09-28
Applicant: NICHIA CORPORATION
Inventor： Tadaaki Ikeda , Masaki Hayashi , Koji Abe , Kimihiro Miyamoto
CPC classification number: H01L33/465 , H01L33/44 , H01L33/483 , H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48227 , H01L2224/48237 , H01L2224/8592 , H01L2224/97 , H01L2933/0025 , H01L2933/0033 , H01L2933/0058 , H01L2933/0066
Abstract: A method of manufacturing a package, the method comprising the steps of: preparing a resin compact having a recess, and including a pair of leads arranged at a bottom surface of the recess, a first resin body forming a lateral wall of the recess, and a second resin body arranged between the pair of leads; forming a reflective film entirely on at least the bottom surface of the recess and an inner surface of the lateral wall of the recess; and removing the reflective film formed on the pair of leads in the recess in the resin compact on which the reflective film has been formed.
-
Patent Agency Ranking
公开(公告)号：US09859480B2
公开(公告)日：2018-01-02
申请号：US15241075
申请日：2016-08-19
Applicant: NICHIA CORPORATION
Inventor： Ryoji Naka , Atsushi Bando , Tomohide Miki , Kimihiro Miyamoto
CPC classification number: H01L33/56 , H01L25/0753 , H01L33/08 , H01L33/48 , H01L33/486 , H01L33/52 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/8592 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014 , H01L2924/00
Abstract: A light emitting device includes a package, at least one light emitting element, a light-transmissive resin, and a light reflecting resin. The package has a recess which includes a bottom surface and an inner peripheral surface. The bottom surface includes a light emitting element mounting region and a groove. The groove has an inner peripheral edge and an outer peripheral edge on the bottom surface to define the groove between the inner peripheral edge and the outer peripheral edge. The at least one light emitting element is mounted on the light emitting element mounting region. The light-transmissive resin is provided in the recess to cover the at least one light emitting element and to be in contact with the groove. The light reflecting resin is provided between the inner peripheral surface of the recess and the light-transmissive resin to reach the outer peripheral edge of the groove.
-
公开(公告)号：US11705541B2
公开(公告)日：2023-07-18
申请号：US16853756
申请日：2020-04-21
Applicant: NICHIA CORPORATION
Inventor： Kimihiro Miyamoto
IPC: H01L33/48 , H01L33/62 , H01L25/075 , H01L27/15 , H01L33/64
CPC classification number: H01L33/486 , H01L25/0753 , H01L27/156 , H01L33/62 , H01L33/64
Abstract: A light-emitting device includes a mounting substrate having a first surface and a second surface opposite to the first surface, the mounting substrate having a first end portion at an end of the mounting substrate; light-emitting elements mounted on the first surface of the mounting substrate other than the first end portion; first terminals provided on the first surface at the first end portion of the mounting substrate and connected to the light-emitting elements; and second terminals provided on the second surface at the first end portion of the mounting substrate and connected to the light-emitting elements.
-
公开(公告)号：US11619368B2
公开(公告)日：2023-04-04
申请号：US17833903
申请日：2022-06-07
Applicant: NICHIA CORPORATION
Inventor： Yoshiyuki Kageyama , Kimihiro Miyamoto , Takashi Tani
IPC: F21V19/00 , F21V29/70 , F21Y115/10
Abstract: A light-emitting module includes a first mounting board having a first surface and a second surface opposite to the first surface. The first mounting board has a recess on the first surface, and the recess has a bottom surface. The first mounting board has an opening passing through the first mounting board from the bottom surface to the second surface. The light-emitting module further includes a second mounting board provided in the recess, a light-emitting element provided on the second mounting board and configured to emit light through the opening, and an elastic cushion provided between the first mounting board and the second mounting board. The light-emitting module also includes a connector. The connector and the opening sandwich a center of the first mounting board when viewed from a direction from the second surface to the first surface.
-
公开(公告)号：US20180097150A1
公开(公告)日：2018-04-05
申请号：US15833644
申请日：2017-12-06
Applicant: NICHIA CORPORATION
Inventor： Tadaaki Ikeda , Masaki Hayashi , Koji Abe , Kimihiro Miyamoto
CPC classification number: H01L33/465 , H01L33/44 , H01L33/483 , H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48227 , H01L2224/48237 , H01L2224/8592 , H01L2224/97 , H01L2933/0025 , H01L2933/0033 , H01L2933/0058 , H01L2933/0066
Abstract: A method of manufacturing a package, the method comprising the steps of: preparing a resin compact having a recess, and including a pair of leads arranged at a bottom surface of the recess, a first resin body forming a lateral wall of the recess, and a second resin body arranged between the pair of leads; forming a reflective film entirely on at least the bottom surface of the recess and an inner surface of the lateral wall of the recess; and removing the reflective film formed on the pair of leads in the recess in the resin compact on which the reflective film has been formed.
-
公开(公告)号：US09711700B2
公开(公告)日：2017-07-18
申请号：US14979558
申请日：2015-12-28
Applicant: NICHIA CORPORATION
Inventor： Kimihiro Miyamoto
IPC: H01L25/00 , H01L33/62 , H01L25/075 , H01L33/48
CPC classification number: H01L33/62 , H01L25/0753 , H01L33/486 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2933/0066 , H01L2924/00014 , H01L2924/00
Abstract: A light emitting device includes a light emitting element and a package. The package includes a first lead frame, a second lead frame, and a resin. The first lead frame has a first surface on which the light emitting element is provided. The first lead frame has a first overlap portion. The second lead frame is spaced apart from the first lead frame and has a second overlap portion. The first overlap portion and the second overlap portion overlap at an overlap position so that the first lead frame extends from the overlap position toward a first direction and a second direction opposite to the first direction and so that the second lead frame extend from the overlap position toward a third direction and a fourth direction opposite to the third direction as viewed along a line substantially perpendicular to the first surface.
-
-
-
-
-
-
-
-
-
Search Results
16
records
(took 0.013 seconds)
