Invention Grant
- Patent Title: Conductive adhesive tape and manufacturing method thereof
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Application No.: US14560188Application Date: 2014-12-04
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Publication No.: US09718994B2Publication Date: 2017-08-01
- Inventor: Seung Hoon Lee , Yong Sik Jung , Yun Mi So
- Applicant: AMOGREENTECH CO., LTD.
- Applicant Address: KR Gimpo-si
- Assignee: AMOGREENTECH CO., LTD.
- Current Assignee: AMOGREENTECH CO., LTD.
- Current Assignee Address: KR Gimpo-si
- Agency: Cantor ColburnLLP
- Priority: KR10-2012-0059900 20120604
- Main IPC: C09J7/02
- IPC: C09J7/02 ; C09J9/02 ; C09J7/04 ; B32B37/15 ; H01B1/00 ; H01B13/32 ; B32B5/26 ; B32B7/12 ; C08K3/04

Abstract:
Provided is a conductive adhesive tape comprising: a substrate that is formed in a nano-web form having a number of pores by spinning a polymer material by a spinning method; and a conductive adhesive layer that is formed in a non-porous form by directly spinning a conductive adhesive material by a spinning method on one or both surfaces of the substrate, or that is laminated on one or both surfaces of the substrate. Accordingly, thickness of the adhesive tape can be made thin, adhesive strength of the adhesive tape can be enhanced, and the adhesive tape can be precisely attached on even a curved surface. Further, when removing the adhesive tape from components, the adhesive layer can be prevented from remaining on the surface of the components.
Public/Granted literature
- US20150086743A1 CONDUCTIVE ADHESIVE TAPE AND MANUFACTURING METHOD THEREOF Public/Granted day:2015-03-26
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