Invention Grant
- Patent Title: Electrostatic chuck with photo-patternable soft protrusion contact surface
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Application No.: US14439464Application Date: 2013-10-29
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Publication No.: US09721821B2Publication Date: 2017-08-01
- Inventor: I-Kuan Lin , Richard A. Cooke , Jakub Rybczynski
- Applicant: Entegris, Inc.
- Applicant Address: US MA Billerica
- Assignee: Entegris, Inc.
- Current Assignee: Entegris, Inc.
- Current Assignee Address: US MA Billerica
- Agency: Entegris, Inc. Legal Dept.
- International Application: PCT/US2013/067301 WO 20131029
- International Announcement: WO2014/070764 WO 20140508
- Main IPC: H01T23/00
- IPC: H01T23/00 ; H01L21/683 ; H02N13/00 ; C23C16/458 ; H01L21/687
Abstract:
In accordance with an embodiment of the invention, there is provided a soft protrusion structure for an electrostatic chuck, which offers a non-abrasive contact surface for wafers, workpieces or other substrates, while also having improved manufacturability and compatibility with grounded surface platen designs. The soft protrusion structure comprises a photo-patternable polymer.
Public/Granted literature
- US20150294891A1 Electrostatic Chuck With Photo-Patternable Soft Protrusion Contact Surface Public/Granted day:2015-10-15
Information query
