Invention Grant
- Patent Title: Power delivery network (PDN) design for monolithic three-dimensional (3-D) integrated circuit (IC)
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Application No.: US14698842Application Date: 2015-04-29
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Publication No.: US09741691B2Publication Date: 2017-08-22
- Inventor: Sung Kyu Lim , Kambiz Samadi , Yang Du
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Muncy, Geissler, Olds & Lowe, P.C./QUALCOMM
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L25/065 ; H01L23/528 ; H01L27/06 ; H01L23/00 ; H01L25/00
Abstract:
Systems and methods relate to power delivery networks (PDNs) for monolithic three-dimensional integrated circuits (3D-ICs). A monolithic 3D-IC includes a first die adjacent to and in contact with power/ground bumps. A second die is stacked on the first die, the second die separated from the power/ground bumps by the first die. One or more bypass power/ground vias and one or more monolithic inter-tier vias (MIVs) are configured to deliver power from the power/ground bumps to the second die.
Public/Granted literature
- US20160322331A1 POWER DELIVERY NETWORK (PDN) DESIGN FOR MONOLITHIC THREE-DIMENSIONAL (3-D) INTEGRATED CIRCUIT (IC) Public/Granted day:2016-11-03
Information query
IPC分类:
