Invention Grant
- Patent Title: Method for processing an electronic component and electronic component arrangement
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Application No.: US14901110Application Date: 2014-06-13
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Publication No.: US09741965B2Publication Date: 2017-08-22
- Inventor: Erwin Lang , Philipp Schwamb , Simon Schicktanz
- Applicant: OSRAM OLED GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM OLED GmbH
- Current Assignee: OSRAM OLED GmbH
- Current Assignee Address: DE Regensburg
- Agency: Viering, Jentschura & Partner mbB
- Priority: DE102013106631 20130625
- International Application: PCT/EP2014/062449 WO 20140613
- International Announcement: WO2014/206775 WO 20141231
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L51/00 ; H01L51/56 ; H01L27/32
Abstract:
Various embodiments may relate to a method for processing an electronic component. The method includes applying a planar structure provided with predetermined separation locations to the electronic component, and removing a part of the applied planar structure, wherein removing includes separating the planar structure at the predetermined separation locations.
Public/Granted literature
- US20160149158A1 METHOD FOR PROCESSING AN ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT ARRANGEMENT Public/Granted day:2016-05-26
Information query
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