Invention Grant
- Patent Title: Device pairing via device to device contact
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Application No.: US14282971Application Date: 2014-05-20
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Publication No.: US09743266B2Publication Date: 2017-08-22
- Inventor: Alexander J. Cohen , Edward K. Y. Jung , Royce A. Levien , Robert W. Lord , Mark A. Malamud , John D. Rinaldo, Jr.
- Applicant: SEARETE LLC
- Applicant Address: US WA Bellevue
- Assignee: Invention Science Fund I, LLC
- Current Assignee: Invention Science Fund I, LLC
- Current Assignee Address: US WA Bellevue
- Main IPC: H04W8/00
- IPC: H04W8/00 ; H04B7/24 ; H04B5/00 ; H04B7/00 ; H04M1/66 ; H04M3/00 ; H04M1/00 ; H04B1/00 ; G10L21/00 ; H04W76/02 ; H04L9/32 ; H04L29/06 ; H04M1/725 ; H04W12/06 ; H04W4/00 ; G10L15/26 ; H04W12/04 ; H04K1/00
Abstract:
A system may include and/or involve a first device, a second device, and logic to effect pairing of the first and second devices upon detection of physical contact between the devices.
Public/Granted literature
- US20140335789A1 DEVICE PAIRING VIA DEVICE TO DEVICE CONTACT Public/Granted day:2014-11-13
Information query
