- 专利标题: Molding method and molding device
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申请号: US14371849申请日: 2013-01-11
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公开(公告)号: US09751252B2公开(公告)日: 2017-09-05
- 发明人: Hirosuke Kawaguchi , Tatsuya Hagino , Satoru Tanaka
- 申请人: SCIVAX CORPORATION
- 申请人地址: JP
- 专利权人: SCIVAX CORPORATION
- 当前专利权人: SCIVAX CORPORATION
- 当前专利权人地址: JP
- 代理机构: Factor Intellectual Property Law Group, Ltd.
- 优先权: JP2012-003616 20120111; JP2012-131838 20120611
- 国际申请: PCT/JP2013/050464 WO 20130111
- 国际公布: WO2013/105658 WO 20130718
- 主分类号: B29C51/10
- IPC分类号: B29C51/10 ; B29L31/00 ; B29K101/12 ; B29K105/00 ; B29C51/06 ; B29C51/26 ; B29C51/42 ; B29C51/46
摘要:
A shaping method and a shaping device are provided which can easily and inexpensively form a curved face in a film including a micropattern. A shaping method is for forming, in a predetermined shaping-target area of a film including a patterned face with a micropattern, and a rear face opposite to the patterned face, a curved face beyond the thickness of the film, and includes a fixing step for fixing an outer edge of the shaping-target area of the film by fixing means, a first heating step for heating the film 20 by heating means 95, and a pressure adjusting step for producing a predetermined pressure difference between both faces of the film by the pressurizing means in such a way that pressure at a side where the film is fixed in the fixing step becomes small to form a pre-curved face.
公开/授权文献
- US20150091220A1 Molding Method And Molding Device 公开/授权日:2015-04-02
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